During this open seminar and panel discussion, young researchers will discuss and debate the challenges that increasing antibiotic resistance entails, and how they may solve these issues.

14:00-16:00 Presentations from invited workshop participants

Buried under, tied up, and let loose - A biophysical understanding of antimicrobial surface coatings  - Bryan Coad, University of Adelaide

An ex-vivo model to investigate host-microbe interactions in human skin - opportunities in device-related infections - Joe Latimer, University of Salford

Nanotools to define cell’s microenvironment in tissue engineering strategies - Rui Domingues, University of Minho

Safety first - the need for pharmacovigilance - Pedro Inacio, University of Helsinki

Title to be announced - David Grainger, University of Utah

16:30-17:30 Panel discussion

Future challenges in development of implantable biomaterials for the post-antibiotic era


One of the problems humans face within the fields of health and medicine is antibiotic resistant bacteria and infections. Today, procedures to replace joints with implants are fairly common, and infections which may occur after such procedures can be treated with antibiotics. However, our extensive use of antibiotic pharmaceuticals makes standard procedures riskier and maybe even impossible to carry out in the future. If antibiotic resistance continue increasing, we won’t be able to fight off postoperative infections.

As part of CAS’ newly developed concept YoungCAS, young and skilled researchers with different backgrounds associated with either the development of implantable medical devices or the treatment of biofilm infections will attend a week's workshop at CAS. The goal is to initiate a collaborative project aimed at developing a new generation of biomaterials that are easily integrated into patients while preventing the formation of biofilm and subsequent antibiotic resistant infections.

Information about the seminar can also be found on UiO's webpages.

Read more about YoungCAS project 2017 here.